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ESD9B, SZESD9B
PACKAGE DIMENSIONS
SOD ? 923
CASE 514AB ? 01
ISSUE B
D
? X ?
b
1
2X
E
2
0.08 (0.0032) X Y
? Y ?
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
MILLIMETERS INCHES
A
DIM
A
b
MIN NOM MAX
0.34 0.37 0.40
0.15 0.20 0.25
MIN
0.013
0.006
NOM
0.015
0.008
MAX
0.016
0.010
c
H E
L
c
D
E
H E
L
0.07 0.12 0.17
0.75 0.80 0.85
0.55 0.60 0.65
0.95 1.00 1.05
0.05 0.10 0.15
0.003
0.030
0.022
0.037
0.002
0.005
0.031
0.024
0.039
0.004
0.007
0.033
0.026
0.041
0.006
SOLDERING FOOTPRINT*
0.90
0.40
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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ESD9B/D
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